Zero tolerance for counterfeit components

Visual & Marking Analysis

Solderability Testing

X-Ray Die Verification

Microscopic inspection of package surfaces, reel packaging, and date codes against manufacturer baselines to detect resurfacing or tampering.

Rigorous lead and termination wetting evaluation confirming pin integrity and compliance with international solder standards.

Non-destructive internal examination verifying wire bonding structures, lead frames, and die presence against known specifications.

Every shipment carries certified test reports and guaranteed replacement for non-conforming lots.

Request inspection sample reports

Connect directly with our Taipei quality assurance team for complete compliance documentation.